Intel's EMIB-T Packaging Yield Target Set at Only 50%

Intel's next-generation advanced packaging technology, EMIB-T, is facing yield challenges, with a mass production yield target of only 50% by the end of 2027. Xinxing Electronics stated during its earnings call that the technology is not yet mature, and all three EMIB-T substrate suppliers have a yield target of 50%. The EMIB-T solution is compared to TSMC's CoWoS-L, with the key difference being the direct embedding of silicon bridges into the substrate, making substrate suppliers crucial in this process. Google's ninth-generation TPU is confirmed to adopt EMIB-T packaging when it goes into mass production in 2028, with MediaTek responsible for chip co-design. If successful, the shipment volume is expected to challenge NVIDIA. Xinxing Electronics mentioned that Intel has provided a profit guarantee mechanism, ensuring supplier profitability even if yields are poor, and that profit margins will exceed the company's average level once the 50% yield target is achieved. However, there remains significant uncertainty about whether EMIB-T can meet its mass production target by the end of 2027.

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