Lei Jun announced that Xiaomi's new generation of Xuanjie family chips, the Xuanjie O3, O100, and D100, have completed back-end verification. The Xuanjie O3 is an AI flagship SoC aimed at high-end products and will debut in the Xiaomi 18 Fold; the Xuanjie O100 is a high-bandwidth AI acceleration chip with a bandwidth of 1.22TB/s, while the Xuanjie D100 is the first domestically produced 3nm high-performance AI chip for autonomous driving, with both latter chips set to officially launch next year. These three chips cover Xiaomi's AI computing needs across its entire ecosystem of vehicles and homes. The Xuanjie O3 is built on a 3nm process, has an area of 133mm², and features 24 billion transistors, a 26% increase over the previous generation, achieving a maximum AnTuTu score of 5.22 million. It has a ten-core all-big core CPU with a maximum frequency of 4.35GHz, scoring 3945 in Geekbench single-core and breaking 15000 in multi-core; the GPU has 16 cores and supports ray tracing, with a 64% reduction in power consumption. This chip supports LPDDR6, has an NPU Tensor computing power of 200TOPS, and is optimized for large language model inference. The Xuanjie O100 is the world's first 6nm 3D wafer-level stacked AI acceleration chip, utilizing Wafer on Wafer packaging, with a bandwidth of 1.22TB/s, achieving a maximum local AI inference speed of 330 Tokens/s in collaboration with the O3. Xiaomi has been rebooting its large chip research and development for over five years, with total investments exceeding 21 billion yuan and a chip team of nearly 3000 people.
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