Samsung Electro-Mechanics and LG Innotek Join Intel's EMIB-T Substrate Supply Chain

Samsung Electro-Mechanics and LG Innotek are advancing their entry into Intel's EMIB-T packaging substrate supply chain, with product development and testing already underway. EMIB connects chips through small silicon bridges, which Intel has primarily used for its own chips; the improved version, EMIB-T, is expanding its external sales. Google's next-generation AI accelerator TPU, set to launch in the second half of next year, will be the first to apply EMIB-T. EMIB-T inserts silicon vias for power transmission within the silicon bridge. According to insiders, Samsung Electro-Mechanics has developed samples of substrates for EMIB over the years and is currently advancing EMIB-T supply based on the 2.1D packaging substrate concept. Recently, LG Innotek delivered EMIB-T packaging substrates to SK Hynix for sample testing, with both parties evaluating product characteristics by installing HBM on the substrates. Currently, EMIB-T packaging substrates are supplied by Japan's Ibiden, Shinkawa Electric, Taiwan's Unimicron Technology, and Austria's AT&S. Ibiden has decided to utilize its idle factory to build a dedicated production line for Intel's EMIB-T substrates, with an investment scale of approximately 20 trillion won, and has already received advance payments from Google, Amazon, and Intel.

This content is provided for general informational purposes only and doesn't constitute financial, investment, legal, or tax advice. Any events, rewards, online promotions, or related information mentioned herein should not be considered a recommendation, solicitation, or invitation to purchase, sell, trade, or otherwise deal in any crypto assets. Crypto assets are highly volatile and may result in loss. The availability of WEEX services, products, and related events may vary by region. You are responsible for ensuring that your participation is in accordance with applicable local laws and regulations.